Semiconductor Wafer Cutting Blades
In today’s technology, the standard diamond dicing blade in the market uses nickel to bind the diamond in place.
Keteca’s patented technology has proven to improve blade life and blade quality. By adding Single Crystal Silicon Carbide Whisker (SiCw) to the nickel diamond plating process, the whisker reinforces the nickel alloy matrix holding the diamond in place. This increases the tensile and bend strength, thereby improving the strength of the blade allowing a better cut quality and wear rate.