KETECA also works closely with our key principals to deliver state-of-the-art equipment and systems, tailored to meet the exacting standards of the semiconductor industry. Our principals, who are our partners, include the following:-
BP Helix
BPM Microsystems is the leading supplier of engineering and production device programmers having sold more fine-pitch automated systems than all its competitors combined. In addition, BP provides high-speed parallel wafer and packaged part test systems.
Phoenix X-ray Systems + Services GmbH designs and builds high resolution industrial x-ray inspection solutions, through the creation of profitable long term customer relationships and delivery of reliable product worldwide.
PVA TePla AG develops, assembles and markets plasma systems for the front end and back-end of the Semiconductor Industry and for Printed Circuit Board industry.
• Front-End Semiconductor
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High capacity, damaged-free Resist Stripping/ Wafer Cleaning.
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Monitoring of ion implantation dose and process related stress in wafers.
• Back-End/Chip Packaging
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Cleaning advanced chip packages prior to Die-attached, Wire-bond and Encapsulation.
• PCB Manufacturing
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Desmearing and Etchback of multilayers PCBs, Flex-Rigid PCBs, Flexboards.
Royce Instruments designs and manufactures assembly tools and bond testing machines for use in the world wide photonic and semiconductor manufacturing industries.
V-TEK Inc. manufactures a variety of taping machines from manually loaded models and to those equipped with automated feeder assemblies. Its entire line is designed for ease of set-up and operation.
